S11 Emerging Technology

Chair: CARL CHIANG, TPCA

Special Talk (15:00~16:00)

S13 HDI Technology

Chair: KyungTae Kang, KIIT

15:30~16:00

EMO-1 Fabrication of Arbitrary 3D Metallic Microstructures on PDMS Substrate
Kuan-Ming Huang, National Taiwan University

Four Essential Skills That Provided My Success In PCBs

Happy Holden, iconnect 007

HDO-1 Development of the novel solder resist oriented towards HDI PCBs
Yanhong Zhang, Taiyo Ink Mfg. Co., Ltd

16:00~16:30

EMO-2 Cu-Ag Nano-Alloy: Progress, Challenges and Opportunities
Xiaoqing Zhang, Zhuhai Topsun Electronic Technology Co., Ltd.

 S12 Design/Modeling

Chair: Chris Jorgenson, IPC

HDO-2 Manufacture of HDI printed circuit board with Rogers base material
Wujie Zhou, Zhuhai Founder PCB Development Co. Ltd.

DSO-1 Unified data structure for describing PCB
SunHue Huh, Polliwog Corporation

16:30~17:00

DSO-2 Accuracy of Material Preparation
Qilin Xu, Shenzhen Suntak Multilayer PCB