회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

    2010 Korea-Japan joint symposium
    • 작성일2010/11/05 11:40
    • 조회 1,301
    when: 11.5(Fri.) 13:00-18:00
    where: (Seoul) Korea Teachers pension bldg

    Subjects
    1. 2011 market trends : chief electronics materials(HMC Securities,
    No Geun Chang)

    2. LED panel/sem. panel trends, 2011 FPC trends
    (Henry H. Utsunomiya, Japan)

    3. Low Dk/Df Materials for High speed PCB
    (Doosan Electonics BG, Shin Joo Ho Senior researcher)

    etc.