Room 305

Room 306

Room 307

S6 Packaging/PCB Materials 2

Chair: CHUN-LAI, CHANG,

Dupont Taiwan Limited

 S7 Processing Technology 2

Chair: David Bergman, IPC

  S8 Embedding Technology

Chair: Alun Morgan, EIPC

10:00~10:30

MAO-21  Feasibility Studies and Development of High

Reliability Photosensitive Solder Resist for IC Package
Tomoya Kudo, Taiyo Ink Mfg. Co., Ltd.

PTO-21 An overview of Registration for Multilayer

Printed Circuit Boards
Paul Walder, MIE Multiline International Europa L.P

EBO-1 Sharing experience in Embedding of Active and Passive Components in Organic PCBs for more  reliability and miniaturization.
Thomas Hofmann, Hofmann Leiterplatten GmbH

10:30~11:00

MAO-22 Advance Research on Resin of Liquid Photosensitive Solder White Ink
Yanhua Yuan, Jiangsu Kuangshun

PTO-22 Technology of Partial Hybrid Dielectric in Same Layer
Ping Zeng, Shenzhen Kinwong Electronic Co., Ltd.

EBO-2 Automotive camera module using passive device embedded substrate
Hyunho Kim, KAIST

11:00~11:30

MAO-23  UV/LED Light initiator and Photoresist curing research
Yanhua Yuan, Jiangsu Kuangshun

PTO-23 Thin substrate development trend in industry

Brandon Kim, K-Sol

EBO-3  Analysis of power module based on embedded  component technology
Lixiang Huang, Shennan Circuits Co., Ltd.