회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

    [KPCA] 2009 Korea-Japan Joint Symposium
    • 작성일2009/11/20 10:02
    • 조회 1,665
    -Date : November 20(Fri), 2009

    -Venue : Seoul, Sahak Pension Bldg. (Seminar Room 2nd Fl.)

    -The Main Subjects

    1) 2010\' Trend of cellular phone market and Technology Trend
    (Mr. Yang Su-Yuel , LG electronics)

    2) High PKG Substrate & Trend of Printed Circuit Board technology
    (Mr. Lee Sang-ho , Qualcomm Korea)

    3) Load map of Embedded PCB
    (Henry H. Utsunomiya , Interconnection Technologies, Inc.)

    4) Load map of Embedded PCB
    (Henry H. Utsunomiya , Interconnection Technologies, Inc.)

    5) Trend of Advanced Optical PCB Technology
    (Mr. Jo Han-Suk , Samsung electro-mechanics)