회원사소식 대한민국 IT 3대 산업 PCB가 반도체 패키징과 함께 더욱 발전해 나아갑니다

회원사소식

    [KPCA] 2008 Korea-Japan Joint Symposium
    • 작성일2008/11/10 09:38
    • 조회 1,789
    - Date: Nov. 07, 2008 13:00~17:50

    - Venue: (Yeouido) Seoul, Sahak Pension Bldg. (Seminar Room 2nd Fl.)

    - Seminars
    1. The Latest Trend of Device Embedded Substrate
    Dr. Katsuya Kikuchi, AIST

    2. EPAD Standardiation-JPCA
    Dr. Shibata Akikazu, JPCA

    3. Technology Trends for PKG Substrate
    Dr. Lee, Jong Jin, Samsung Electronic Engeneering

    4. Technology Trends for High-Performance PCB Materials
    Dr. Nam, DongKi, Doosan ElectronicsBG